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885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 1 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo applications ? usable bandwidth of 79 mhz ( ch1 C 13) ? for wlan coexistence to b7, b38, b40 and b41 lte applicatio ns ? lte gateways, datacards and routers ? wifi antenna extractor circuits. ? high-power wlan access points and small cells ? 2.4 ghz ism applications ? wi -fi set top box, gateways and routers- 1.7 x 1.3 x 0.46 mm pin configuration* pin no. label 1 rf3 4 rf2 6 s md?#?1 to rf2 7 smd?#?2 to rf1, smd?#?4 to ground 9 rf1 (ant) 2,3,5,8,10 ground *note: see evaluation board section page 11 for details on optimal grounding functional block diagram 6 7 8 9 5 10 1 2 3 4 general description the 885137 is a high-performance bulk acoustic wave (baw) filter module designed to meet the strict lte requirements for use in lte from 699 ?C? 2400 mhz and 2496 ?C? 2690 mhz and wlan requirements. 885137 is specifically designed to meet the high performance expectations of insertion loss and rejection for lte and wlan systems under all operating conditions. 885137 allows diplexing the cellular path and a filtered wifi path to one antenna port. the 885137 uses common module packaging techniques to achieve the industry standard 1.7 x 1.3 x 0.46 mm footprint. ordering information part no. description 885137 packaged part 885137- evb evaluation board description standard t/r size = 15,000 units/reel product features ? diplex er is formed with wifi bandpass and bandstop filters. ? highly selective baw filters achieving low insertion loss and high attenuation over full bandwidth and operating conditions ? rejection in wlan band of 10 ? db minimum ? single antenna port, diplexing ? performance -40 to +9 5 oc ? rohs compliant, pb-free module package downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 2 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo absolute maximum ratings parameter rating notes: 1. operation of this device outside the parameter ranges given may cause permanent damage. 2. specifications are not guaranteed over all operating conditions. 3. td -scdma, lte continuous; simultaneously tx power presence at rf2 and rf3. storage temperature ? (1) ?55 to +150?c operating temperature? (2) ?20 to +85?c rf input power rf2 (cell port) +25 ? dbm rf3 (wifi port) +20 ? dbm electrical specifications (1) tempop = ? 40 to +9 5c, characteristic impedance [zo] = 50 . (unless otherwise n ot ed) rf1 to rf2 (ant- cell) parameter (3) conditions min typ? (2) max units insertion loss 699 ?C? 960 ?mhz? 1574 ?C? 1615 ?mhz? 1710 ?C? 2170 ?mhz? 2300 ?C? 2370 ?mhz? 2370 C?2377.5? mhz ? 2496 C?2510? mhz ? 2510 C?2570? mhz ? 2570 C?2690? mhz ? - 1.3 0 .8 1.0 1.9 2.5 2.0 1.0 1.0 2.3 0.9 1.3 3.2 4.6 3.7 1.5 1.4 db? passband ripple ?? (within any 20 mhz) 2300?C?2370 mhz 2396?C?2510 mhz 2510?C?2570 mhz - 0.4 1.1 0.3 1.3 2.8 0.7 db p-p vswr (i n/ o ut) 2300??C??2370?mhz? 2496??C??2510?mhz? 2510??C??2570?mhz? 2570??C??2690?mhz? - 1.4 1.9 1.4 1.4 2.0 2.9 2.1 2.0 - notes: 1. all specifications are based on the triquint schematic for the reference design shown on page 5. 2. in production, devices will be tested at room temperature to a gua rdbanded specification to ensure electrical compliance over temperature. 3. electrical margin has been built into design to account the vari ations due to temperature drift and manufacturing tolerances. downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 3 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo electrical specifications ( 1) tempop = ? 40 to +9 5c, characteristic impedance [zo] = 50 . (unless otherwise noted) rf1 to rf2 (ant- cell) parameter (3) conditions min typ? (2) max units attenuation ?? (6) ? 2402? C?2478 .64 ? mhz ? (4) 2478.64 ?C? 2482 ?mhz? (4) ??ism ch?1? (5) ??ism ch?2? (5) ism ch ?3 ? (5) ism ch?4 (5) ism ch?5 (5) ism ch?6 (5) ism ch?7 (5) ism ch?8 (5) ism ch?9 (5) ism ch?10? (5) ism ch?11 (5) ism ch?12? (5) ism ch?13? (5) 15 13 20 17 16 16 16 16 16 17 17 21 24 19 17 17 17 23 21 19 19 18 18 19 19 22 25 26 23 21 - db? rf2 to rf3? isolation (cell - wifi) attenuation?? (6) ? 2300??C??2370?mhz? 2402 ?? C ?? 2482?mhz? (4) ism ch?1??C??13? (5) 2570??C??2690?mhz? (4) 2496??C??2500? mhz ? 2500??C??2510?mhz? 2510??C??2570?mhz? 2370??C??2400?mhz? 41 18 18 43 13 25 49 12 45 20 20 46 28 45 46 15 - db note s: 1. all specifications are based on the triquint schematic for the reference design shown on page 5. 2. in production, devices will be tested at room temperature to a gua rdbanded specification to ensure electrical compliance over temperature. 3. electrical margin has been built into design to account the va riations due to temperature drift and manufacturing tolerances. 4. data is the integrated value of the linear s- parameter over a 1?mhz range in the indicated band. 5. data is the integrated value of the linear s- parameter over 19?mhz range in the indicated band. 6. reference to zero db. downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 4 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo electrical specifications (1) tempop = ?? 40 to +9 5c, characteristic impedance [zo] = 50 . (unless otherwise noted) rf1 to rf3 (ant- wifi) parameter (3) conditions min typ? (2) max units insertion loss? 2402?C?2480? mhz ? ? 2402? C?2475.81? mhz ? (4) ?2475.81?C?2480? mhz ?? (4) ism ch?1??C??12? (5) ism ch?1??C??13? (5) - 2.6 2.4 2.4 1.8 1.8 4.2 3.4 4.3 2.3 2.7 db? passband ripple 2402? C?2480?mhz ?2402?C?2480?mhz? ( within any 20?mhz ) - 1.5 1.3 3.1 2.7 db p-p attenuation ? (6) 10 ?? C ?? 1549 ?mhz? 1549 ?? C ?? 1615 ?mhz? 1710??C??1990?mhz? 2110 ?? C ?? 2170 ?mhz? 2300 ?? C?? 2370 ?mhz? 2496 C 2500?mhz?? 2500??C??25 7 0?mhz? 25 7 0??C ??2 69 0?mhz? 44 44 41 40 46 12 22 42 45 45 42 42 48 25 39 44 - db vswr (in/out) 2402? C?2480 mhz - 1.7 2.6 - notes: 1. all specifications are based on the triquint schematic for the reference design shown on page 5. 2. in production, devices will be tested at room temperature to a gua rdbanded specification to ensure electrical compliance over temperature. 3. electrical margin has been built into design to account the vari ations due to temperature drift and manufacturing tolerances 4. data is the integrated value of the linear s- parameter over a 1?mhz range in the indicated band. 5. data is the integrated value of the linear s- parameter over 19?mhz range in the indicated band. 6. reference to zero db. downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 5 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo electrical specifications (1) tempop = ? 30 to +8 5c, characteristic impedance [zo] = 50 . (unless otherwise noted) rf1 to rf2 (ant- cell) parameter (3) conditions min typ? (2) max units insertion loss 699? C?960?mhz? 1574? C?1615?mhz? 1710? C?2170?mhz? 2300? C?2370?mhz? 2370 C?2377.5? mhz ? 2496 C?2510? mhz ? 2510 C?2570? mhz ? 2570 C?2690? mhz ? - 1.3 0.8 1.0 1.9 2.5 2.0 1.0 1.0 2.3 0.9 1.2 3.1 4.4 3.6 1.5 1.4 db? passband ripple ?? (within any 20 mhz) 2300?C?2370 mhz 2396?C?2510 m hz 2510?C?2570 mhz - 0.4 1.1 0.3 1.3 2.7 0.7 db p-p vswr (in/out) 2300??C??2370?mhz? 2496??C??2510?mhz? 2510??C??2570?mhz? 2570??C??2690?mhz? - 1.4 1.9 1.4 1.4 2.0 2.9 2.1 2.0 - notes: 1. all specifications are based on the triquint schematic for th e reference design shown on page 5. 2. in production, devices will be tested at room temperature to a gua rdbanded specification to ensure electrical compliance over temperature. 3. electrical margin has been built into design to account the vari ations due to temperature drift and manufacturing tolerances. downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 6 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo electrical specifications (1) tempop = ? 30 to +8 5c, characteristic impedance [zo] = 50 . (unless otherwise noted) rf1 to rf2 (ant- cell) parameter (3) conditions min typ? (2) max units attenuation?? (6) ? 2402? C?2478.64?mhz ? (4) 2478.64?C?2482?mhz? (4) ??ism ch?1? (5) ??ism ch?2? (5) ism ch ?3? (5) ism ch?4 (5) ism ch?5 (5) ism ch?6 (5) ism ch?7 (5) ism ch?8 (5) ism ch?9 (5) ism ch?10? (5) ism ch?11 (5) ism ch?12? (5) ism ch?13? (5) 15 14 20 17 16 16 16 16 16 17 17 21 24 19 17 18 18 25 22 20 19 19 19 20 21 23 26 27 26 22 - db? rf2 to rf3? isolatio n (cell - wifi) attenuation?? (6) ? 2300??C??2370?mhz? 2402??C??2482?mhz? (4) ism ch?1??C??13? (5) 2570??C??2690?mhz? (4) 2496??C??2500?mhz? 2500??C??2510?mhz? 2510??C??2570?mhz? 2370??C??2400?mhz? 41 18 18 43 13 26 49 12 49 19 20 45 28 44 53 16 - db note s: 1. all specifications are based on the triquint schematic for the reference design shown on page 5. 2. in production, devices will be tested at room temperature to a gua rdbanded specification to ensure electrical compliance over temperature. 3. electrical margin has been built into design to account the va riations due to temperature drift and manufacturing tolerances. 4. data is the integrated value of the linear s- parameter over a 1?mhz range in the indicated band. 5. data is the integrated value of the linear s- parameter over 19?mhz range in the indicated band. 6. reference to zero db. downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 7 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo electrical specifications (1) tempop = ??30 to +85c, characteristic impedance [zo] = 50 . (unless otherwise noted) rf1 to rf3 (ant- wifi) parameter (3) conditions min typ? (2) max units insertion loss? 2402? C?2480? mhz ? ?2402?C?2475.81? mhz ? (4) ?2475.81?C?2480? mhz ?? (4) ism ch?1??C??12? (5) ism ch?1??C??13? (5) - 2.6 2.4 2.4 1.8 1.8 4.0 3.4 4.1 2.2 2.6 db? passband ripple 2402? C?2480?mhz ?2402?C?2480?mhz? ( within any 20?mhz ) - 1.5 1.3 2.9 2.6 db p-p attenuation? (6) 10??C??1549?mhz? 1549??C??1615?mhz? 1710??C??1990?mhz? 2110??C??2170?mhz? 2300??C??2370?mhz? 2496 C 2500?mhz?? 2500??C??2570?mhz? 2570??C??2690?mhz? 44 44 41 40 46 12 23 42 45 45 42 42 48 25 39 44 - - vswr (in/out) 2402? C?2480 mhz - 1.7 2.5 - notes: 1. all specifications are based on the triquint schematic for the reference design shown on page 5. 2. in production, devices will be tested at room temperature to a gua rdbanded specification to ensure electrical compliance over temperature. 3. electrical margin has been built into design to account the vari ations due to temperature drift and manufacturing tolerances. 4. data is the integrated value of the linear s- parameter over a 1?mhz range in the indicated band. 5. data is the integrated value of the linear s- parameter over 19?mhz range in the indicated band. 6. reference to zero db. downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 8 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo electrical specification s (1) tempop = 0 to +70 c, characteristic impedance [zo] = 50 . (unless otherwise noted) rf1 to rf2 (ant- cell) parameter (3) conditions min typ? (2) max units insertion loss 699? C?960?mhz? 1574? C?1615?mhz? 1710? C?2170?mhz? 2300? C?2370?mhz? 2370 C?2377.5? mhz ? 2496 C?2510? mhz ? 2510 C?2570? mhz ? 2570 C?2690? mhz ? - 1.3 0.8 1.0 1.9 2.5 2.0 1.0 1.0 2.3 0.9 1.2 3.0 4.3 3.3 1.5 1.3 db? passband ripple ?? (within any 20 mhz) 2300?C?2370 mhz 2396?C?2510 mh z 2510?C?2570 mhz - 0.4 1.1 0.3 1.2 2.3 0.6 db p-p vswr (in/out) 2300??C??2370?mhz? 2496??C??2510?mhz? 2510??C??2570?mhz? 2570??C??2690?mhz? - 1.4 1.9 1.4 1.4 2.0 2.8 2.0 2.0 - notes: 1. all specifications are based on the triquint schematic for the reference design shown on page 5. 2. in production, devices will be tested at room temperature to a gua rdbanded specification to ensure electrical compliance over temperature. 3. electrical margin has been built into design to account the vari ations due to temperature drift and manufacturing tolerances. downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 9 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo electrical specifications (1) tempop = 0 to +70 c, characteristic impedance [zo] = 50 . (unless otherwise noted) rf1 to rf2 (ant- cell) parameter (3) conditions min typ? (2) max units att enuation?? (6) ? 2402? C?2478.64?mhz ? (4) 2478.64?C?2482?mhz? (4) ??ism ch?1? (5) ??ism ch?2? (5) ism ch?3? (5) ism ch?4 (5) ism ch?5 (5) ism ch?6 (5) ism ch?7 (5) ism ch?8 (5) ism ch?9 (5) ism ch?10? (5) ism ch?11 (5) ism ch?12? (5) ism ch?13? (5) 15 14 21 17 16 16 16 16 16 17 18 22 24 20 17 18 18 25 22 20 19 19 19 20 21 23 26 27 26 22 - db? rf2 to rf3? isolation (cell - wifi) attenuation?? (6) ? 2300??C??2370?mhz? 2402??C??2482?mhz? (4) ism ch?1??C??13? (5) 2570??C??2690?mhz? (4) 2496??C??2500?mhz? 2500??C??2510?mhz? 25 10??C??2570?mhz? 2370??C??2400?mhz? 41 18 18 43 14 27 49 12 49 19 20 45 28 44 53 16 db notes: 1. all specifications are based on the triquint schematic for the reference design shown on page 5. 2. in production, devices will be tested at room temperature to a gua rdbanded specification to ensure electrical compliance over temperature. 3. electrical margin has been built into design to account the vari ations due to temperature drift and manufacturing tolerances. 4. data is the integrated value of the linear s-param eter over a 1?mhz range in the indicated band. 5. data is the integrated value of the linear s- parameter over 19?mhz range in the indicated band. 6. reference to zero db. downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 10 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo electrical specifications (1) tempop = ? 0 to + 70 c, characteristic impedance [zo] = 50 . (unless otherwise noted) rf1 to rf3 (ant- wifi) parameter (3) conditions min typ? (2) max units insertion loss? 2402? C?2480? mhz ? ?2402?C?2475.81? mhz ? (4) ?2475.81?C?2480? mhz ?? (4) ism ch?1??C??12? (5) ism ch?1??C??13? (5) - 2.6 2.4 2.4 1.8 1.8 3 .8 3.3 3.8 2.2 2.5 db? passband ripple 2402? C?2480?mhz ?2402?C?2480?mhz? ( within any 20?mhz ) - 1.5 1.3 2.7 2.4 db p-p attenuation? (6) 10??C??1549?mhz? 1549??C??1615?mhz? 1710??C??1990?mhz? 2110??C??2170?mhz? 2300??C??2370?mhz? 2496 C 2500?mhz?? 2500??C??2570?mhz? 2570??C??2690?mhz? 44 44 41 41 46 13 26 42 45 45 42 42 48 25 39 44 - - vswr (in/out) 2402? C?2480 mhz 1 1.7 2.4 - notes: 1. all specifications are based on the triquint schematic for the reference design shown on page 5. 2. in production, devices will be tested at room temperature to a gu ardbanded specification to ensure electrical compliance over temperature. 3. electrical margin has been built into design to account the vari ations due to temperature drift and manufacturing tolerances. 4. data is the integrated value of the linear s- parameter over a 1?mhz range in the indicated band. 5. data is the integrated value of the linear s- parameter over 19?mhz range in the indicated band. 6. reference to zero db. downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 11 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo evaluation board notes: 1. this is the optimum impedance in order to achieve the performa nce shown. 2. pcb: 0.75 x 0.75 x 0.0 63 ; construction: 1 oz cu top, middle and bottom layers ; material in between middle and top layer: tly- 5a (.0075); material in between mid-bottom layers: fr4 . ( dimensions are in inches) bill of material reference des. value description manuf. part number u1 n/a diplex er triquint 885137 l1 3.2 ? nh 3.2 ? nh 0.1 ? nh; 0201 smd murata lqp03tn3n2b02 l2 3.6 ? nh 3.6 ? nh 0.1 ? nh; 0201 smd murata lqp03tn3n6b02 l3 6.2 ? nh 6. 2 ? nh 3 ? %; 0201 smd murata lqp03tn6n2h02 r1 0 0.0 ohm 1/20 ? w jumper; 0201 panasonic erj1gn0r00c sma n/a sma connector radiall 9602 -1111- 018 pcb n/a printed circuit board triquint 961009 pcb mounting pattern notes: 1. all dimensions are in millimeters. angles are in degrees. 2. this drawing specifies the mounting pattern used on the triquint evaluation board for this product. some modification may be necessary to suit end user assembly materials and processes . downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 12 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo performance plots - rf1 to rf2 (ant- cell) test conditions unless otherwise noted: temp= +25 ? c uplink frequency response d b frequency (mhz) -70 -60 -50 -40 -30 -20 -10 0 2300 2400 2500 2600 2700 uplink passband response d b frequency (mhz) -10 -8 -6 -4 -2 0 2375 2400 2425 2450 2475 2500 uplink wideband response d b frequency (mhz) -100 -80 -60 -40 -20 0 10 1507.5 3005 4502.5 6000 uplink return loss d b frequency (mhz) -40 -30 -20 -10 0 2350 -1 -0 .8 -0 .6 -0 .4 -0 .2 0 0.2 0.4 0.6 0.8 1 -1 -0 .5 0 0.5 1 uplink path - ant port impedance -1 -0 .8 -0 .6 -0 .4 -0 .2 0 0.2 0.4 0.6 0.8 1 -1 -0 .5 0 0.5 1 uplink port impedance downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 13 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo performance plots - rf1 to rf3 (ant- wifi) test conditions unless otherwise noted: temp= +25 ? c downlink frequency response d b frequency (mhz) -60 -50 -40 -30 -20 -10 0 1980.001 2160.0008 2340.0005 2520.0003 2700 downlink passband response d b frequency (mhz) -6 -5 -4 -3 -2 -1 2300 2397 2494 downlink wideband response d b frequency (mhz) -60 -50 -40 -30 -20 -10 0 10 1507.5 3005 4502.5 6000 downlink return loss d b frequency (mhz) -20 -17 -14 -11 -8 -5 -2 2300 2350 2400 2450 2500 2550 2600 2650 -1 -0 .8 -0 .6 -0 .4 -0 .2 0 0.2 0.4 0.6 0.8 1 -1 -0 .5 0 0.5 1 downlink path - ant port impedance -1 -0 .8 -0 .6 -0 .4 -0 .2 0 0.2 0.4 0.6 0.8 1 -1 -0 .5 0 0.5 1 downlink port impedance downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 14 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo performance plots - rf2 to rf3 (cell - wi fi ) test conditions unless otherwise noted: temp= +25 ? c isolation d b frequency (mhz) -70 -60 -50 -40 -30 -20 -10 0 2200 2300 2400 2500 2600 2700 antenna return loss d b frequency (mhz) -60 -50 -40 -30 -20 -10 0 2000 2100 2200 2300 2400 2500 2600 2700 downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 15 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo tape and reel information standard t/r size = 15,000 units/reel package information, marking and dimensions 0.46 nom. 0.50 max. 0.24 1.54 1.70 0.55 0.205 0.45 0.20 1.15 1.30 0.235 0.24 code marking date code m *c4 id dot wwy mfg site package style: csp-1713 dimensions: 1.7 x 1.3 x 0.46 mm package for surface mount technology terminations: au plating 0.5 - 1.0 m, over a 2-6 m ni plating approximate weight 3.96mg. the date code consists of: ww = 2 digit week, y = last digit of year, m = manufacturing site code. notes: 1. all dimensions shown are typical in millimeters. 2. an asterisk (*) in front of the marking code indicates prototype. 3. all tolerances are 0.05mm except overall length and width 0.10mm. a a b b 1.75 4.0 4.0 2.0 8.0 3.50 0.60 1.5 section a-a section b-b 0.63 0.250 5 max. typ. 1.47 1.88 8.8 id dot 2.0 direction of travel ?330 ?20.2 ?13.0 ?102 2.7 downloaded from: http:///
885137 wifi/lte baw diplex er advanced data sheet rev a 08 - 28 - 15 - 16 of 16 - disclaimer: subject to change without notice ? 2015 triquint semiconductor, inc www.triquint.com ?/?www.qorvo.com rfmd + triquint = qorvo contact information for the latest specifications, additional product information, worldwide sales and distribution locations: web: www.triquint.com tel: 877 - 800 -8584 email: customer.support@qorvo.com for information about the merger of rfmd and triquint as qorvo: web: www.qorvo.com for technical questions and application information: email: flapplication.engineering@tqs.com product compliance information esd sensitivity ratings caution! esd-sensitive device esd rating: class 1b test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: b test: machine model (mm) standard: jedec standard jesd22-a115 solderability compatible with both lead-free (260c maximum reflow temperature) and tin/lead (245c maximum reflow temperature) soldering processes. refer to soldering profile for recommended guidelines. rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp-a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating msl rating:not applicable, hermetically sealed test: 260?c convection reflow standard: jedec standard ipc/jedec j-std- 020 important notice the information contained herein is believed to be reliable. triquint mak es no warranties regarding the information contained herein. triquint assumes no responsibility or liability wh atsoever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with al l faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explici tly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to suc h information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life-saving, or life- sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. downloaded from: http:///

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